Stack role
Packaging / OSAT
Assembly and advanced packaging that join dies, memory, and substrates into a module. This is where chiplets become a shippable part.
Covered names
Other roles
Analog / power ICs
Cooling / thermal
Data-center infra
Earth observation
EDA / design
Foundry
GPU / AI accelerators
Ground systems
HBM / memory
Hyperscaler
Lithography
Materials
Networking & optics
Packaging / OSAT
Power & energy
Quantum compute
Satellite communications
Security software
Solar power
Space launch
Spacecraft
Storage
Test / metrology
Wafer equipment